Product types: double-sided, multi-layer (1-6 layers), tinplate, gold-plated plate, gold-deposited plate, tin-deposited plate, organic welding film plate, soft-hard bonding plate

* Selection of materials: PI, PET

* Processing board thickness: 0.06mm-0.6mm

* Maximum Machining Size: 250mm *500mm

* Substrate copper foil thickness: 18, 35 and 70 microns

* Minimum aperture: 0.25mm

* Minimum linewidth: 0.076mm

* Minimum line spacing: 0.076mm

* Tolerance: Width (+20%)? Aperture (+3mil)? Shape processing: +0.13mm (special process set)

* Inspection standard: Inspection according to IPC-6013 and IPC-600 standards